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Flip Pre-Aligner
Introduction
Specification
Other products
  • Class 1 cleanness design
  • Support 8" & 12" wafer
  • Edge wafer and align ID
  • Optional version with OCR
  • Inspect defects on the surface of wafer with rotating
  • Automatic align and OCR
  • Meets SEMI E19.3, E48, E111, E112, S2 and S8 standards and CE certify
  • Clapping position located with rocker sensor
  • Loosen wafer micro-switch loosen sensor to avoid slip and fall
  • Hold and clap wafer with sloped wheels with groove

Specifications

1

Dimension

W 607mm x D 435mm x H 458.5mm

2

Rotate Stroke

0°- 360°

3

Load

12" wafer

4

Wafer Type

12" wafer

5

Power Requirement

220V 5A 50Hz

6

Weight

29kg 

7

Alignment

2.5s-3s

8

MCBF

50,000 cycles

9

MTTR

<1 hour

10

Clapping Sensor

1 pcs

11

Loosen Sensor

1 pcs

12

Rocker Sensor

1 pcs

13

Rotate sensor

1 pcs

14

Align Sensor

1 pcs

15

Communication

EIA-RS232C(SECS Ⅰ/Ⅱ)

16

OCR Device(Optional)

OCR

17

Operation

Local operation or Host comm

Inquiry
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