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Wafer size |
Dia. 300 ± 0.2 mm, Thickness: 0.5-1.0mm |
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Carrier |
SEMI standard 300mm FOUP/FOSB |
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Cleanness |
Class-1 (option: ISO Class 1) |
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Through put (by dual arm robot) |
>500 WPH (Without OCR and Aligner) >200 WPH (With OCR and Aligner) |
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End-effector |
Vacuum blade or edge gripper |
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Robot repeatability |
± 0.1mm |
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Aligner repeatability |
± 0.1mm |
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Communication |
HSMS or SECS I / SECS II messages |
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MTTR |
< 2 hours |
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MTBF |
>4,000 hours |
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OS |
Window 7 Professional or Compatible |
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Load ports qty |
2 Ports |
3 Ports |
4 Ports |
2Ports + 2Ports(embedded in stocker) |