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Core Components
Location： Home > Products > Core Components
Core Components
Pre-Aligner
Consultation Inquiry
Introduction
Specification
Other products
  • Wafer Centering and Angle Alignment
  • Compact Design
  • High Throughput, Speed & Accuracy
  • 2” to 12” options
  • 20,000hrs MTBF
  • High Reliability

Contents

Detail contents

Specification

Wafer Handing

Wafer handing size

200/300 mm SEMI standard wafer

Alignment time

≤3.2 sec(when handing 300mm wafer)

Wafer off-center limit

Within ±5 mm

Wafer holding method

Backside vacuum chuck

Wafer holding check

Vacuum sensor with digital display

Accuracy

Centering accuracy

±0.1 mm

Rotation accuracy

±0.1°

Utility

Power

24V DC±10%,5A

Vacuum

Less than -50kpa

Communication

Serial R2-232C,parallel I/O

Other

Weight

About 6 kgf

User interface

RS232C
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