EFEM FAQ-Semiconductor Transfer and Handling Technical Support

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Q: What are the customization options for your EFEM?

A: Customizable options include pod type compatibility, wafer size, number of load ports, robotic arms, EEF types, purge systems, and RFID integration to meet specific fab requirements.
Q: Does your EFEM support OHT (Overhead Transport) systems?

A: Absolutely. Our EFEMs are OHT compatible, allowing for automated pod delivery and retrieval in modern fabs.
Q: Can your EFEM integrate with existing process tools?

A: Yes, our EFEMs are designed for seamless integration with a wide range of semiconductor process tools and are compliant with SEMI standards like E19.4.
Q: What cleanliness level does the EFEM maintain?

A: Our EFEM systems are designed to meet ISO Class 1 cleanliness standards with active air flow control and optional purge features to maintain a contamination-free environment.
Q: Is your EFEM compatible with both FOUP and SMIF pod types?

A: Yes, our EFEMs can be configured to support both FOUP and SMIF systems, including RSP 200 and EUV pods, ensuring flexibility for various fab environments.
Q: What is an EFEM and what does it do?

A: An EFEM (Equipment Front End Module) is a subsystem used in semiconductor manufacturing equipment to handle wafer loading, unloading, alignment, and environmental control between the FOUP/SMIF pod and the process chamber. It ensures precise, clean, and automated wafer handling.
Q: What types of wafer sizes are supported by EFEMs?

A: Most EFEMs are designed to support 200mm and 300mm wafers, depending on the configuration. Custom options may be available for other wafer sizes.

Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.

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