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WAFER STANDARD MECHANICAL INTERFACE (SMIF) ISOLATION TECHNOLOGY
admin| Jan 22, 2025| Return |Share to:

As is well known, traditional wafers need to be produced and transported under relatively enclosed and dust-free conditions. Usually, the production equipment is placed in a high-cleanliness room that meets the requirements for wafer production. With the rapid development of modern semiconductor technology, the requirements for the process environment have become even more stringent. High cleanliness, high yield rate, high flexibility, and low cost have become the trends in industry competition. It is very difficult for traditional clean technologies to meet such requirements. Therefore, the SMIF isolation technology has emerged as the times require.


Wafer isolation technology is also known as the Standard Mechanical Interface (SMIF for short). The technical concept is equivalent to directly setting up a cleanroom within the equipment, which can provide an ISO 2-level wafer cassette transfer environment in an integrated circuit manufacturing FAB of a sub-grade (ISO class 6 or higher). Research data from SEMI proves that compared with the open wafer cassette transfer in ISO-5, ISO-4, and ISO-3 level equipment, the protection of wafer cleanliness provided by the SMIF technology has increased by 100 times, 30 times, and 10 times respectively. The main technologies include the wafer cassette (POD), SMIF I/O (input & output), and the Mini-environment.


Wafer Cassette (POD)
The wafer cassette is a sealed container used to store wafers during the storage and transportation processes. It can accommodate 25 pieces of 200/300mm wafers inside. It separates the wafers from the surrounding environment to ensure a sealed clean environment and reduce the vibration of wafers during the transfer process.


SMIF I/O (input&Output)
Through an automated mechanical device, the wafer carrier (cassettes) is taken out from the wafer cassette (POD) by the SMIF robot arm (SMIF I-Arm) and placed on the interface of the process equipment for processing. Then, the cassettes are retrieved and put back into the wafer cassette (POD). The entire process is isolated from the influence of the external environment, which is more reliable and has a higher fault tolerance rate.


Mini-environment
The mini-environment contains highly integrated components such as process equipment, wafer cassettes (POD), wafer carriers (cassettes), robot arms, lifting/lowering modules, and a variety of sensors. It performs complex mechanical procedures such as loading, transferring, and conveying through a specific SMIF system. It is integrated with the SMIF system through appropriate interfaces to form an independent work unit. It prevents the possible pollution caused by the slight organic volatile substances overflowing from the materials of the equipment itself, the generation of contaminants during the movement process, and the sealing performance of the equipment, etc.

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