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Utilizing a dual-arm structure to achieve high-speed wafer transfer.
Carrying capacity: Below 3Kg at the third joint of the arm.
Wafer holding methods: Vacuum suction/Clamping/Contact Bernoulli/Non-contact Bernoulli.
Carrying capacity: Below 3Kg at the third joint of the arm.
| Handling Items | 3"/4"/6"/8"/12" Wafers | ||
| Movable Range (Arm Travel Distance) | Arm | Theta Rotation | Lifting: |
|
290/376mm |
340° |
240/300/400/500 | |
| Transfer Speed （Average Speed） | 750mm/S |
235~340°/S |
500mm/S |
| Arm Type | Dual Arms | ||
| Handling Height | 700-1020mm | ||
| Repeatability Accuracy | Within ±0.1mm | ||
| Communication Protocol | HEX/ASCII | ||
| Communication Method | EtherNet/RS232 | ||
| Cleanliness | Highest ISO Class 1 | ||
| Facility Requirements |
Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa |
Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
Copyright © FORTREND. Any commercial promotion of goods or services, whether directly or indirectly to consumers on this website, is considered 'advertising' (excluding product-related information such as packaging, specifications, and after-sales support)
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