Optional pseudo-horizontal multi-joint motion corresponding to parallel equipment layout.
The EEF employs a closed-loop control system using a gripping mechanism.
Carrying capacity: Below 3Kg at the third joint of the arm.
Compatible with various types of Forks to meet the wafer transfer needs for different applications.
Wafer holding methods: Clamping type, Lifting type.
Based on the equipment layout, you can choose either an upper or lower fixing method.
| Handling Items | Mask Wafer/Square Glass Wafer | ||
| Movable Range (Arm Travel Distance) | Arm | Theta Rotation | Lifting: |
|
376mm |
340° |
240/300/400/500 | |
| Transfer Speed （Average Speed） | 600mm/S |
235°/S |
250mm/S |
| Arm Type | Single Arm | ||
| Handling Height | 520-820mm | ||
| Repeatability Accuracy | Within ±0.1mm | ||
| Communication Protocol | HEX/ASCII | ||
| Communication Method | EtherNet/RS232 | ||
| Cleanliness | Highest ISO Class 1 | ||
| Facility Requirements |
Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa |
Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
Copyright © FORTREND. Any commercial promotion of goods or services, whether directly or indirectly to consumers on this website, is considered 'advertising' (excluding product-related information such as packaging, specifications, and after-sales support)
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