Carrying capacity: Below 3Kg at the third joint of the arm.
The arm section is coated with Teflon to ensure corrosion resistance.
O-ring seals are used at component joint interfaces.
The waterproof structure of the Z-axis utilizes an accordion-style bellows.
Wafer fixing methods: Vacuum suction type / Clamping type.
Handling Items | 3/4/6/8/12 inch wafers | ||
Movable Range (Arm Travel Distance) | Arm | Theta Rotation | Lifting: |
290/376mm |
340° |
300/400/500 | |
Transfer Speed (Average Speed) | 750mm/S |
235°/S |
500mm/S |
Arm Type | Single Arm | ||
Handling Height | 780--980mm | ||
Repeatability Accuracy | Within ±0.1mm | ||
Communication Protocol | HEX/ASCII | ||
Communication Method | EtherNet/RS232 | ||
Cleanliness | Highest ISO Class 1 | ||
Facility Requirements |
Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa |
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