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This robotic arm is suitable for wafer transfer in waterproof environments and can be used in conjunction with a wafer flipper and edge grip mechanism. It has a protection level of IP64 and is capable of handling wafers in acidic, alkaline, and cleaning environments.
  • Optional pseudo-horizontal multi-joint motion corresponding to parallel equipment layout.
  • Carrying capacity: Below 3Kg at the third joint of the arm.

  • The arm section is coated with Teflon to ensure corrosion resistance.

  • O-ring seals are used at component joint interfaces.

  • The waterproof structure of the Z-axis utilizes an accordion-style bellows.

  • Wafer fixing methods: Vacuum suction type / Clamping type.

Product Specifications
Handling Items 3/4/6/8/12 inch wafers
Movable Range (Arm Travel Distance)  Arm Theta Rotation Lifting:

290/376mm

340°

300/400/500
Transfer Speed (Average Speed) 750mm/S

235°/S

500mm/S

Arm Type Single Arm
Handling Height 780--980mm
Repeatability Accuracy Within ±0.1mm
Communication Protocol HEX/ASCII
Communication Method EtherNet/RS232
Cleanliness Highest ISO Class 1
Facility Requirements Power: 220V, 10A
Vacuum: -70~-90Kpa
Positive Pressure: 0.1~0.5Mpa

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For urgent requests, please call the local office directly.
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Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.

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