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· The robot arm can perform horizontal multi-joint movements to correspond to the parallel configuration of equipment layout.
· The EEF (End-Effector) can achieve a rotation of 0–180°.
· Handling weight: Based on the third joint of the arm, the weight should be under 3 kg.
· It can be equipped with different types of Forks to meet the wafer transportation requirements of various working conditions.
· Wafer holding methods: Vacuum suction type/Clamping type/Contact Bernoulli type/Non-contact Bernoulli type.
· Depending on the equipment layout, the upper fixing method or the lower fixing method can be selected.
| Handling Items | 3"/4"/6"/8"/12" Wafers | ||
| Movable Range (Arm Travel Distance) | Arm | Theta Rotation | Lifting: |
|
290/376mm |
340° |
300/400/500 | |
| Transfer Speed （Average Speed） | 500mm/S |
340°/S |
500mm/S |
| Arm Type | Dual Arms | ||
| Handling Height | 700-800mm | ||
| Repeatability Accuracy | Within ±0.1mm | ||
| Communication Protocol | HEX/ASCII | ||
| Communication Method | EtherNet/RS232 | ||
| Cleanliness | Highest ISO Class 1 | ||
| Facility Requirements |
Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa |
Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
Copyright © FORTREND. Any commercial promotion of goods or services, whether directly or indirectly to consumers on this website, is considered 'advertising' (excluding product-related information such as packaging, specifications, and after-sales support)
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