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Fortrend equipment front - end  modules are mainly designed to meet customized process requirements and are compatible with wafers ranging from 3" to 12".
The internal cleanliness of the equipment can reach ISO Class 1, and it can adapt to wafers of different sizes and types, featuring high cleanliness, high compatibility, and other characteristics;
It is compatible with all SEMI-standard FOUP, FOSB, SMIF POD, and Cassettes.

Wafer thickness support: 100 - 1500μm

Workstations 2 to 8 are optional

Supports the transportation of wafers of various sizes

Various feeding methods are available

Interface with multiple process equipment

SECS/GEM

Light curtain

OCR (top or bottom)

N2 purge LP

Product Specifications

Rated Voltage Phase AC 220V 50/60 Hz
Rated Power 3.52kW(Decide by config)
Body material Painted SPCC (RAL 9003)
Comm Interface RJ45
Comm protocol ASCI/HEX/HSMS&SECS Ⅱ
Software

Fortrend independently developed software

Cleanliness Class 1 (ISO 3)
End-effector Vacuum Blade /Edge Grip / Bernoulli /Custom
Uptime ≥99%
MTBF 4000 hours
MTTR ≤4 hours
MTBA >100 hours
MTTA <10 hours
MCBF 100,000Wafers
Wafer Breakage Rate 1/1,000,000
OCR Accuracy Rate for Bare Wafers ≥99.8%
Repeatability of Positioning Accuracy 士0.1mm




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Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.

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408-734-9311sales@fortrend.com

2220 O’Toole Avenue, San Jose, CA 95131

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