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Wafer thickness support: 100 - 1500μm
Workstations 2 to 8 are optional
Supports the transportation of wafers of various sizes
Various feeding methods are available
Interface with multiple process equipment
SECS/GEM
Light curtain
OCR (top or bottom)
N2 purge LP
| Rated Voltage | Phase AC 220V 50/60 Hz |
| Rated Power | 3.52kW(Decide by config) |
| Body material | Painted SPCC (RAL 9003) |
| Comm Interface | RJ45 |
| Comm protocol | ASCI/HEX/HSMS&SECS Ⅱ |
| Software |
Fortrend independently developed software |
| Cleanliness | Class 1 (ISO 3) |
| End-effector | Vacuum Blade /Edge Grip / Bernoulli /Custom |
| Uptime | ≥99% |
| MTBF | ≥4000 hours |
| MTTR | ≤4 hours |
| MTBA | >100 hours |
| MTTA | <10 hours |
| MCBF | 100,000Wafers |
| Wafer Breakage Rate | ≤1/1,000,000 |
| OCR Accuracy Rate for Bare Wafers | ≥99.8% |
| Repeatability of Positioning Accuracy | 士0.1mm |
Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
Copyright © FORTREND. Any commercial promotion of goods or services, whether directly or indirectly to consumers on this website, is considered 'advertising' (excluding product-related information such as packaging, specifications, and after-sales support)
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