The original factory is equipped with a MAPPING system, compatible with 150/200mm wafers, can detect problems such as stacks, oblique films, and eliminate risk of collision.
A variety of customized components that can be used to deal with different working conditions on the scene, such as:Do you need to connect to the car.
| Pod/WAFER size |
150/200 mm(SMIF |
| Size |
491mm W x 468mm D x 815mm H |
| Weight |
40 Kg(Depends on configuration) |
| Rated voltage |
DC 24 |
| Rated power |
120W |
| The main materia | Aluminum alloy, stainless steel (SUS 304) |
| Noise level |
< 60 dBA |
| Communication |
Serial EIA-RS232C, Parallel I/O |
|
Communication protocol |
HEX、SECS |
| Cleanliness |
Class 1@0.1μm |
| Options |
The ID read and write device is equipped with an RFID module or Irlink |
Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
Copyright © FORTREND. Any commercial promotion of goods or services, whether directly or indirectly to consumers on this website, is considered 'advertising' (excluding product-related information such as packaging, specifications, and after-sales support)
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