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BCB Cure

 BCB Cure

 

BCB CureBenzocyclobutene (BCB) is used to create photosensitive polymers, which require fewer processing steps than dry etch materials. BCB-based polymer dielectrics may be spun on or applied to a variety of substrates for use in MicroElectro-Mechanical Systems (MEMS) and microelectronics processing.

Typical applications:

  • Adhesive wafer bonding
  • Low-K dielectrics
  • CMOS
  • Bipolar devices
  • Optical interconnects
  • Intracortical neural implants

BCB’s primary advantage over other polymers is its compatibility with conventional integrated circuit (IC) processing techniques as well as with various metallization systems. BCB also has a low-K dielectric, a low dissipation factor at high frequencies, low moisture absorption, and a high degree of planarization.

YES-450PB ovens and the fully automated YES-PBV300 are ideally suited for this process.
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