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High Temperature Vacuum Cure Oven SIO-300-450 series Home>Products> Wafer Cure Oven System 
High Temperature
Vacuum Cure Oven
  • Fortrend-YES have partnered to develop SIO-300-450 series of  High temperature, Air cooled, Controlled proces gas compositon, Laminar cross flow, Vertical vacuum oven - the result of many years experience in the design and manufacture of low particle and oxygen concentration 

              - Polyimide Cure
              - BCB cure
              - Photorsist Cure
              - Copper Anneal
              - Copper Oxide Removal

  • Up to 300mm capacity of wafer 50 each chamber 
  • 200mm Wafer auto load available
  • Continuoue horizental lamina flow of N2 
  • Low O2  < 10 ppm
  • Process temperature range 150~450 °C
  • Temperature uniformity better than ± 3.5  °C
  • Maximum heating ramp 8°C/min, and cooling 6°C/min,It vary with chamber temperature 
  • N2 pre-heating
  • Exhaust condensate trap 


  • System cleanness Class 1
  • Oven cleanness Class 10
  • Recipe: Programmable
  • Process Cycle:Programmable

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