This robot arm is suitable for material handling in high-cleanliness conditions. It employs a closed-loop control method and is designed for applications where the end-effector (EEF) needs to be rotated. It is used for high-speed transportation of semiconductor wafers in atmospheric environments and is applicable to various semiconductor equipment, including Equipment Front End Modules (EFEMs), sorters, coating and developing machines, cleaning devices, and inspection equipment.
· The EEF (End-Effector) can achieve a rotation of 0–180°.
· Handling weight: Based on the third joint of the arm, the weight should be under 3 kg.
· It can be equipped with different types of Forks to meet the wafer transportation requirements of various working conditions.
· Wafer holding methods: Vacuum suction type/Clamping type/Contact Bernoulli type/Non-contact Bernoulli type.
· Depending on the equipment layout, the upper fixing method or the lower fixing method can be selected.
Handling Items | 3"/4"/6"/8"/12" Wafers | ||
Movable Range (Arm Travel Distance) | Arm | Theta Rotation | Lifting: |
290/376mm |
340° |
300/400/500 | |
Transfer Speed (Average Speed) | 500mm/S |
340°/S |
500mm/S |
Arm Type | Dual Arms | ||
Handling Height | 700-800mm | ||
Repeatability Accuracy | Within ±0.1mm | ||
Communication Protocol | HEX/ASCII | ||
Communication Method | EtherNet/RS232 | ||
Cleanliness | Highest ISO Class 1 | ||
Facility Requirements |
Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa |
SEMICONDUCTOR WAFER AUTOMATIC TRANSMISSION SYSTEM TOTAL SOLUTION
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